3.0mmT Gray Easy Release Construction Thermal Pad for Routers
The TIF1120N-40-10F use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TIF100N-40-10F-Specification-sheet.pdf
Features
> Good thermal conductive: 4.0 W/mK
>Thickness: 3.0mmT
>hardness:55±5 shore 00
>Colour: Gray
>Available in varies thicknesses
>Broad range of hardnesses available
>Moldability for complex parts
Applications
>cooling components to the chassis of frame
>High speed mass storage drives
>Heat Sinking Housing at LED-lit BLU in LCD
>LED TV and LED-lit lamps
>RDRAM memory modules
>Micro heat pipe thermal solutions
| Typical Properties of TIF1120N-40-10F Series |
| Color | Gray | Visual | Composite Thickness | Thermal Impedance@10psi
(℃-in²/W) |
| Construction &
Compostion | Ceramic filled silicone elastomer | *** | 10mils / 0.254 mm | 0.16 |
| 20mils / 0.508 mm | 0.20 |
| Specific gravity | 2.1 g/cm3 | ASTM D297 | 30mils / 0.762 mm | 0.31 |
| 40mils / 1.016 mm | 0.36 |
| Thickness | 3.0mmT | *** | 50mils / 1.270 mm | 0.42 |
| 60mils / 1.524 mm | 0.48 |
| Hardness | 55±5 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.53 |
| 80mils / 2.032 mm | 0.63 |
| Thermal conductivity | 4.0W/mk | ISO22007-2.2 | 90mils / 2.286 mm | 0.73 |
| 100mils / 2.540 mm | 0.81 |
| Continuos Use Temp | -40 to 160℃ | *** | 110mils / 2.794 mm | 0.86 |
| 120mils / 3.048 mm | 0.93 |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 | 130mils / 3.302mm | 1.00 |
| 140mils /3.556 mm | 1.08 |
| Dielectric Constant | 4.7 MHz | ASTM D150 | 150mils / 3.810 mm | 1.13 |
| 160mils / 4.064 mm | 1.20 |
| Volume Resistivity | 1.0X1012
Ohm-cm | ASTM D257 | 170mils / 4.318 mm | 1.24 |
| 180mils / 4.572 mm | 1.32 |
| Fire rating | 94 V0 | equivalent
UL | 190mils / 4.826 mm | 1.41 |
| 200mils / 5.080 mm | 1.52 |
| Thermal conductivity | 4.0 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Company Profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
FAQ:
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
