2.5W / mK Low Viscosity Thermal Conductive Glue with -40℃ - 130℃ Service Temperature
TIE™ 280-25AB is a two compound, high thermal conductive, low temperature cured, long pot life, fire resistant epoxy encapsulant compound. It is design for potting of capacitors and electrical devices.
TIE280-25 A&B.pdf
Features
> Good thermal conductive: 2.5W/mK
> Excellent insulation and smoothly sourface.
> Low shrinkage
> Low viscosity, expediting air releaseed.
> Excellent in solvents and water proof.
> Longer life time.
> Excellent thermal shock efficiecy and impact resistance
Application
> Automotive starters potting; General potting Thermal detector potting
> Ferrite adhesion; TIP type LED; Good adhesion to aromatic polyester
> Relay sealant; Good adhesion to rubber, ceramics PCB and plastics
> Power transformers and coils; Potting capacitors Potting of small electrical devices
> Adhesion to metal glass and plastic LCD & substrates adhesion; Coating and sealant; Coil ; IGBTS; Transformer; Fire retardant
> Optical / medical component adhesive
| Typical Uncured Material TIE™ 280-25A (Resin) |
| Color | Black |
| Viscosity@25℃ Brookfield | 3,000 cPs |
| Specific Gravity | 2.1 g/cc |
| Shelf life @25℃ in sealed container | 12 months |
| TIE™ 280-25B (Hardener) |
| Color | Black |
| Viscosity@25℃ Brookfield | 5,000 cPs |
| Shelf life @25℃ in sealed container | 12 months n |
| Mix Ratio (By weight) TIE™ 280-12A : TIE™ 280-12B = 100 : 100 |
| Viscosity @25℃ | 4,000 cPs |
| Working pot life (250 g @25℃) | 45 min |
| Specific Gravity | 2.1g/ccn |
| Cure Schedule |
| Cure 12 hours at 25℃ |
| Cure 30 minutes at 70℃ |
| Cured Properties |
| Hardness @25℃ | 85 Shore D |
| Service temperature | -40℃ to +130℃ |
| Glass transition temperature Tg | 92℃ |
| Elongation | 0.10% |
| Coefficient of thermal expansion, / ℃ | 3.0 X 10-5 |
| Fire resistance UL | Meet 94 V-0 |
| Moisture absorption % wt gain 24 hours water immersion @25℃ | 0.1 |
| Thermal |
| Thermal Conductivity | 2.5 W/m-K |
| Thermal Impedance @10psi | 0.31 ℃-in²/W |
| ELECTRICAL AS CURED |
| Dielectric Strength | 300 volts / mil |
| Dielectric Constant | 4.2 MHz |
| Dissipation factor | 0.029 MHz |
| Volume resistivity, ohm-cm @ 25℃ | 3.0 X 1012 |
Product Tags:
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2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D Images
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