Highest Thermal Gap Filler Thermal Conductive Pad For Electronics Heat Transfer
The TIF800QE series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It ofers excellent compliance, allowing it to conform tightly to heat sources with varying shapes and height differences. Even in confined or irregular spaces,it maintains stable thermal conductivity,enabling efficient heat transfer from discrete components or the entire PCB to the metal housing or heat sink.This significantly improves the heat dissipation eficiency of electronic lcomponents, thereby enhancing operational stability and extending device lifespan.
Features:
> Good thermal conductive: 13.0W/mK
> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Available in different thickness options
Applications:
> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> LED drivers and lamps
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
| Typical Properties of TIF®800QE Series |
| Color | Gray | Visual |
| Construction | Ceramic filled silicone elastomer | ****** |
| Thickness Range(inch/mm) | 0.03~0.20inch(0.75mm~5.0mm) | ASTM D374 |
| Density(g/cc) | 3.7 g/cc | ASTM D792 |
| Hardness | 35 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature(℃) | -40 to 200℃ | ****** |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Dielectric Constant @ 1MHz | 8 | ASTM D150 |
| Volume Resistivity | ≥1.0X10¹² Ohm-meter | ASTM D257 |
| Flame rating | V-0 | UL94(E331100) |
| Thermal conductivity | 13.0W/m-K | ASTM D5470 |
Product Specifications
Standard Thickness: 0.02 to 0.20 (0.50 to 5.0mm) with increments of 0.01 (0.25mm).
Standard Size: 16" X 16" (406mm X 406mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options:NS1 (Non-adhesive treatment),DC1(Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
Notes:FG(Fiberglas)provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25 to 0.5mm).
TheTIF series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Company profile
Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
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