Low Thermal Inpedance 9W/MK Silicone Thermal Congductive Gel For Vihicel Enginee Controler
Company Profile
Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:
Thermal gap pad
Thermal graphite sheet/film
Thermal double-sided tape
Thermal insulation pad
Thermal grease
Phase change material
Thermal gel
All products are compliant with UL94 V-0, SGS and ROHS standards.
Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL
Products desription
TIF®090-11 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIFo90-11 has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment. Typical applications include flip-chip microprocessors, PPGAs, micro BGA packages, BGA packages, DSP chips, circular silicon chips, LED lighting, and other high-power electronic components.
Feature
> Thermal conductivity: 9.0W/mK
> Soft, very low compression
> Low thermal inpedance
> Operate automaticly
> Proven long-term reliability
Application
> Heat-sink & frame
> LED backlight module,LED lighting
> High speed hardware driver
> Micro heat pipe
> Vihicel enginee controler
> Telecom industry
> Semiconductor automatic laboratory equipment
| TIF®090-11 Typical Property |
| Property | Value | Test method |
| Color | Gray | Visual |
| Construction & Composition | Ceramic filled silicon material | ***** |
| Flow Rate(g/min) | 20 | Ziitek Test Methbod |
| (30cc syringe/ 2.5mm or rifice/90 psi) |
| Density(g/cm³) | 3.45 | ASTM D792 |
| Thermal conductivity(W/mK) | 9.0 | ASTM D5470 |
| Thermal resistance @10Psi(℃-in²/W) | 0.089 | ASTM D5470 |
| Thermal resistance @50Psi(℃-in²/W) | 0.055 | ASTM D5470 |
| Recommended Operating temp | -45~200℃ | ***** |
| Breakdown Voltage(V/mm) | ≥4000 | ASTM D149 |
| Bond line Thickness (mm) | 0.4 | Ziitek Test Method |
| Shelf life | 12 months | **** |
| Flame Rating | V-0 | UL 94 |
Packing details
30 cc/pc, 98 pc/box;
300 cc/pc , 6 pc/box
We offer the custom packaged in syringes for automated despensing applications.
Please contact us for confirming.
Independent R&D team
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
2. Fill out the message form by entering a subject line, and message to us.
This message should include any questions you might have about the products as well as your purchase requests.
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4. We will reply you as soon as possible with Email or online
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Product Tags:
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Low Thermal Inpedance 9W/MK Silicone Thermal Conductive Gel For Vehicle Engine Control Images
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